High-precision X-Ray CT imaging
Angled 3D CT imaging and specially designed inspection algorithms allow automated inspection that is both fast and accurate.
The combination of CT imaging and Omron’s inspection algorithms allows the creation of detailed inspection standards with specificity in terms of separation in inspected cross-sections. In production environments with clear pass/fail criteria, this eliminates false fails and overlooked defects.
The VT-X700 then precisely identifies the inspection locations within the 3D data, enabling it to maintain consistent inspection quality in an automated inline system that inspects every item on the SMT line.
inquiry@x700-omron.com
- Features
- Productivity
- Reliability
- Operativity
- NEW Installation Experience
- Safe & Secure
- Specifications
Among the fastest in the SMT industry
High-speed inspection based on efficient x-ray inspection techniques.
Omron goes for the high speed CT inspection technology to realize the complete in-line inspection, 43 seconds for 240 x 160mm PCB, which can meet the typical requirement for the production tact time.
World’s fastest. The capability of the in-line high speed CT.
Omron's unique high-speed image capturing and reconstructing technology enable in-line CT inspection in the real production environment. Here is the capability of high speed processing, 3.6 seconds per FOV ( Field of View).
Clear and Precise 3D-CT images
The VT-X700 realizes reconstructing the precise 3D images by Omron’s unique X-Ray CT technology. The hidden solder joint, such as BGA’s wettability, can be seen clearly, that traditionally is available only by the physical cross-section inspection.
High Speed Inspection --- 3.6 seconds per FOV (Field of View)
Both-sided PCBs with several components can be precisely inspected at one time.
The VT-X700 realizes reconstructing the precise 3D images by Omron’s unique X-Ray CT technology. The hidden solder joint, such as BGA’s wettability, can be seen clearly, that traditionally is available only by the physical cross-section inspection.
High-precision PCB check identifies the causes of defects.
During analysis imaging, high resolution (10 μm) is combined with a large number of projections (128) to obtain high-quality 3D data, allowing the trial sample to be evaluated and the causes of any defects arising during processes to be analyzed.
Perform precise 3D inspection of invisible areas through CT imaging.
Both-sided PCBs with several components can be precisely inspected at one time.
The VT-X700 realizes reconstructing the precise 3D images by Omron’s unique X-Ray CT technology. The hidden solder joint, such as BGA’s wettability, can be seen clearly, that traditionally is available only by the physical cross-section inspection.
Precise automated inspection of components other than BGAs.
The VT-X700 can inspect not only BGAs but also bottom-side terminal components such as CSPs, QFPs, LGAs, QFNs, R/C chip components, and THD components. Inspection efficiency improves dramatically.
Designed for greater ease of use from the user's standpoint.
Automatic window pasting
The inspection window is automatically pasted into place in alignment with the detected pin positions to complete the inspection program settings.
X-ray CT Inspection System, VT-X700:The ECU production line at AISIN AW Co., Ltd.
Implementation of one-hundred percent inline automated inspection greatly contributes to the improvement of the micro CSP solder joint quality.
By AISIN AW Co., Ltd.
Background of the implementation of X-ray CT Inspection System, VT-X700.
In recent years, micro CSP begins to be used in the SMT industry to miniaturize the ECU size and then the solder joint quality for the micro CSP gains much more recognition.
In traditional method, the inline inspection can be done only by the transparent X-ray system (2D X-ray system) and visual inspection for the periphery pins. The 2D X-ray system can detect obviously odd solder shape. However, the problem is that, the head-in-pillow cannot be detected by 2D X-ray system. And also head-in-pillow cannot be detected by the electrical test such as an in-circuit tester. To detect the head-in-pillow, the destruction test was the common method. In the case of the 2D X-ray inspection, the one-hundred percent inline inspection was impossible because it took vast amount of hours and required more precise X-ray detection.
We need unconventional inspection system that enables both non-destructive one-hundred percent inline inspection and the short-time analysis for the root cause finding of the defects.
Based on our investigation, we decided to implement the VT-X700, that provides high-speed CT scan with 3D X-ray, and also we started collaborating with OMRON to develop the entire inspection system.
Realize one-hundred percent inline automated inspection by speeding up X-ray image detection and inspection.
The VT-X700 with high-speed inspection technology realizes one-hundred percent inline inspection within our specific line tact time to detect the solder joint defects for more than 1,000 bumps of the micro CSP. Furthermore, during the inspection,the 3D image data can be saved into the host server at the same time without delaying the inline tact time.
inquiry@x700-omron.com
Collaborative development of the micro CSP algorithm enables the head-in-pillow detection.
To detect the head-in-pillow by 3D X-ray inspection, the target layer should be extracted precisely and also the differentiate points should be detected stably. Those two points must be realized because the micro CSP for our particular ECU product line has small diameter bumps and the ball pitch is very small.
We and OMRON, as a partner, realize detecting the head-in-pillow by developing the dedicated inspection algorithm for the micro CSP. The main issues are as follows.
- ・Optimize extracting the inspection layer by correlating the actual measured value of the cross section with the measured value calculated by the VT-X700.
- ・Stabilize detecting the differentiate points based on filtering out the noise and precisely detecting the layer images.
Root cause finding method by co-developed analysis system with VT-X700.
To find the root cause for the actual defects in a short time, the inspection machine must differentiate the over rejects (*) from the actual defects without the recheck process and then the system must show the target process that should be fixed. In addition, the zero-recheck process can minimize the X-ray exposure to the products.
As we implement the AOI (Automated Optical Inspection) system in addition to the X-ray inspection system VT-X700, we can utilize the inspection result data from the both systems. The co-developed analysis system realize the short-time and efficient root cause findings. And also the system is capable as mentioned below;
- ・The real-time defect analysis feature is available right after unloading the product from the line.
- ・The actual solder shapes can be figured out by 3D Voxel Viewer.
- ・All the actual defect images can be extracted automatically and displayed all at once so that the causal process can be identified easily.
In the case when it is difficult to differentiate the over rejects from the actual defects, the secondary analysis feature is available based on more detailed/precise 3D data.
(*) The over reject; Determining a good solder joint as a defect.
Based on the above statement, the implementation of the X-ray inspection system, VT-X700, has a huge role in building a relationship of trust with our customers and also makes a huge contribution to differentiate us from our competitors.
X-ray leakage of less than 0.5 μSv/h during irradiation.
Achieve both safety and longer lifetime by using the pulse shot method.
OMRON has developed an original pulse imaging method that irradiates only at the moment of imaging (prior method irradiated continuously). This method reduces the amount of radiation and allows for more safety. With the effective use of the X-ray source, the lifetime is increased. The maintenance cost is also reduced.
With a design that limits exposures to minute amounts, yearly radiation leakage is less than one-tenth of natural environmental levels.
Hardware configuration/function specifications
| Item | Descriptoion | |
|---|---|---|
| Model | VT-X700-M | |
| Inspected components | BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal components, QFN, LGA, etc. Please let us know by e-mail if you have any questions. |
|
| Inspected items | Openings, dewetting, solder amount, shifting, foreign object stuck, bridging, lead presence,
etc. (selectable to suit detected item). Please let us know by e-mail if you have any questions. |
|
| Imaging specifications |
Imaging method | 3D-slice imaging using parallel CT |
| Resolution | 10, 15, 20, 25 or 30 μm (selectable to suit detected item) | |
| X-ray source | Micro-focus closed tube (110 kV) | |
| X-ray detector | Flat panel detector (5 megapixels) | |
| Inspected PCBs |
Size | M-size PCB (50 mm x 50 mm to 330 mm x 255 mm); thickness: 0.4 mm to 3.0 mm |
| Weight | 2.0 kg or lighter (with components mounted) | |
| Mounted component height | Top: 50 mm or shorter; bottom: 20 mm or shorter | |
| Warpage/Flexure | 2.0 mm or less | |
| Device specifications |
Dimentions | 1,550 (W) x 1,650 (D) x 1,620 (H) mm |
| Weight | Approx. 2,900 kg | |
| PCB transfer height | 900±15 mm | |
| Power supply voltage | Single phase, 200 to 240 VAC (±10%) | |
| Rated power | 8.0 kVA | |
| X-ray leakage | Less than 0.5 μSv/h | |
Caution: In the interest of product improvement, specifications are subject to change without notice.
Dimentions
Caution: All units are in millimeters unless otherwise indicated.
inquiry@x700-omron.com
